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6. Specification

Table of Contents:

1. Introduction
2. Gaseous Conduction
3. Glow Discharge
4. Sputter Coating
5. Operating Characteristics
6. Specification

The overall result is a low voltage head with low energy input. The possibility of thermal damage due to radiant heating and electron bombardment is considered negligible.

Vacuum 0.1 to 0.05 Torr
Sputtering Voltage 100 to 150 Volts
Current 0 to 50mA
Deposition 0 to 50nm/min
Grain Size Less than 5nm
Temperature Rise Less than 10oC

K550X Sputter Coater

Figure 5: K550X Fully Automatic Sputter Coater With facilities for Film Thickness and Peltier Stage Modules

Micrograph of Concrete

Figure 6: The Micrograph is 3-day old concrete, freshly fractured. This is a typically difficult sample as the surface is highly granular and uneven and therefore susceptible to charging during SEM. However, after coating in the K550X such problems were not encountered. (Coating conditions: Gold, 20mA, 2 minutes, 0.1Torr, coating thickness 11nm).

It is, of course, possible to satisfy very precise parameters by the selection of target material, voltage deposition current and vacuum. Under these conditions, it is possible to achieve thin films to 10nm with grain sizes better than 2nm and temperature rises of less than 1oC. The application of sputter coating has been well established. However, the improved performance of Scanning Electron Microscopy realises the capabilities of this series of Sputter Coaters.

K575X Turbo Pumped Sputtering System

Figure 7 K575X Turbo Pumped Sputter Coater

The Cathode target material is commonly Gold. However, to achieve finer grain size, and thinner continuous coatings, it is advantageous to use cathode target materials such as Chromium. To achieve sputtering with this target material requires vacuums somewhat better than those achievable with a Rotary Vacuum Pump. The K575X uses a 'Turbo' pump, backed up by a Rotary Vacuum pump, the complete pumping sequence being under automatic control, the vacuum of the order of 1 x 10-3mbar.

The twin head version of the above, the K575XT has two sputter heads. These are arranged such that for special coating applications two sequential layers of a target material can be deposited without breaking the vacuum seal in this automatic unit.

The K675X system employs a magnetron target assembly, this enhances the efficiency of the process using low voltages and giving a fine grain, cool sputtering. There are three such target assemblies in the K675X, positioned to give coating over a large diameter which, together with a rotating sample table, ensures even depositions. This method allows standard targets to be utilised, and avoids the necessity of special large profile targets. The triple-target system is particularly useful in the semi-conductor wafer industry. It has a turbo-molecular pump backed by a rotary vacuum pump.

The integrated instrument panel and plug-in electronics maximise 'up-time' and, with user-friendly designs, ensures satisfactory multi-user discipline. The sputtering parameters can be pre-set, including the gas bleed needle valve, which has electromagnetic valve back-up. The independent vacuum pump is controlled by the instrument throughout the fully automatic coating cycle.

It can be used to sputter coat targets such as gold, and also targets that may need pre-cleaning, or the removal of oxide layers such as chromium. A shutter assembly is fitted as standard, which allows a sputter cleaning and the sputter cycle to be carried out while maintaining the vacuum. The SC3000, launched at the start of the new millennium, is specifically designed for the 12-inch wafer market.

Figure 8: K675X Turbo Pump large sample semi-conductor wafers

Standard Vacuum Gold Coating

Gold Sputter Coating, Standard Vacuum System

Turbo Vacuum Chromium Coating

Chromium Sputter Coating, Turbo Vacuum System



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